Invention Grant
- Patent Title: Semiconductor device and method of manufacturing the same
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Application No.: US17003245Application Date: 2020-08-26
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Publication No.: US11217605B2Publication Date: 2022-01-04
- Inventor: Shibun Tsuda
- Applicant: RENESAS ELECTRONICS CORPORATION
- Applicant Address: JP Tokyo
- Assignee: RENESAS ELECTRONICS CORPORATION
- Current Assignee: RENESAS ELECTRONICS CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: McDermott Will & Emery LLP
- Priority: JPJP2019-186897 20191010
- Main IPC: H01L27/12
- IPC: H01L27/12 ; H01L27/092 ; H01L27/11 ; H01L29/08 ; H01L29/417 ; H01L29/51 ; H01L21/84 ; H01L21/02 ; H01L21/32 ; H01L21/8238

Abstract:
The first gate insulating film is an insulating film made of silicon oxide, and to which hafnium (Hf) is added without addition of aluminum (Al). Also, the second gate insulating film is an insulating film made of silicon oxide, and to which aluminum is added without addition of hafnium. The third gate insulating film is an insulating film made of silicon oxide, and to which aluminum is added. Further, the fourth gate insulating film is an insulating film made of silicon oxide, and to which hafnium is added. Accordingly, it is possible to reduce the power consumption of the semiconductor device.
Public/Granted literature
- US20210111193A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2021-04-15
Information query
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