Invention Grant
- Patent Title: Architecture design of monolithically integrated 3D CMOS logic and memory
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Application No.: US16560490Application Date: 2019-09-04
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Publication No.: US11217583B2Publication Date: 2022-01-04
- Inventor: Lars Liebmann , Jeffrey Smith , Anton J. deVilliers , Kandabara Tapily
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Main IPC: H01L27/092
- IPC: H01L27/092 ; H01L29/423 ; H01L23/535 ; H01L29/417 ; H01L23/528 ; H01L29/08 ; H01L21/3213 ; H01L21/822 ; H01L21/8238 ; H01L21/768 ; H03K19/0948 ; H01L27/02 ; H01L29/10

Abstract:
A semiconductor device is provided. The device includes a plurality of transistor pairs that are stacked over a substrate. Each of the plurality of transistor pairs includes a n-type transistor and a p-type transistor that are stacked over one another. The device also includes a plurality of gate electrodes that are stacked over the substrate with a staircase configuration. The plurality of gate electrodes are electrically coupled to gate structures of the plurality of transistor pairs. The device further includes a plurality of source/drain (S/D) local interconnects that are stacked over the substrate with a staircase configuration. The plurality of S/D local interconnects are electrically coupled to source regions and drain regions of the plurality of transistor pairs.
Public/Granted literature
- US20200075592A1 ARCHITECTURE DESIGN AND PROCESSES FOR MANUFACTURING MONOLITHICALLY INTEGRATED 3D CMOS LOGIC AND MEMORY Public/Granted day:2020-03-05
Information query
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