Invention Grant
- Patent Title: Power module and method for manufacturing power module
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Application No.: US16977172Application Date: 2019-03-05
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Publication No.: US11217571B2Publication Date: 2022-01-04
- Inventor: Julien Morand , Remi Perrin , Roberto Mrad , Jeffrey Ewanchuk , Stefan Mollov
- Applicant: MITSUBISHI ELECTRIC CORPORATION
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI ELECTRIC CORPORATION
- Current Assignee: MITSUBISHI ELECTRIC CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: EP18305374 20180330
- International Application: PCT/JP2019/009551 WO 20190305
- International Announcement: WO2019/188153 WO 20191003
- Main IPC: H01L25/11
- IPC: H01L25/11 ; H01L25/18 ; H01L25/00

Abstract:
A power module (1) is disclosed, comprising: first and second substrates (10), each substrate patterned layer of electrically conductive material (12), a plurality of pre-packed power cells (20), positioned between the substrates, each cell comprising: an electrically insulating core (21) embedding at least one power die (22), and two external layers (23) of electrically conductive material on opposite sides of the electrically insulating core (21), said external layers being respectively connected to each patterned layers of the substrates, wherein each external layer of a pre-packed power cell comprises a contact pad (230) connected to a respective contact (220) of the power die through connections arranged in the electrically insulating core (21), said contact pad having a surface area greater than the surface area of the power die electrical contact to which it is connected.
Public/Granted literature
- US20210043613A1 POWER MODULE AND METHOD FOR MANUFACTURING POWER MODULE Public/Granted day:2021-02-11
Information query
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