Invention Grant
- Patent Title: Metallic adhesive compositions having good work lives and thermal conductivity, methods of making same and uses thereof
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Application No.: US16500607Application Date: 2018-06-07
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Publication No.: US11217554B2Publication Date: 2022-01-04
- Inventor: Matthew Wrosch , Catherine A. Shearer
- Applicant: ORMET CIRCUITS, INC.
- Applicant Address: US CA San Diego
- Assignee: ORMET CIRCUITS, INC.
- Current Assignee: ORMET CIRCUITS, INC.
- Current Assignee Address: US CA San Diego
- Agent Mitchell Brustein
- International Application: PCT/US2018/036385 WO 20180607
- International Announcement: WO2018/231612 WO 20181220
- Main IPC: H01L23/373
- IPC: H01L23/373 ; H01L23/00
Abstract:
Thermally conductive adhesive materials having a first metallic component with a high melting point metal; a second metallic component having a low melting point metal; a fatty acid, an optional amine, an optional triglyceride and optional additives. Also provided are methods of making the same and uses thereof for adhering electronic components to substrates.
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