Invention Grant
- Patent Title: Substrate transfer apparatus
-
Application No.: US16874015Application Date: 2020-05-14
-
Publication No.: US11217469B2Publication Date: 2022-01-04
- Inventor: Taiki Sato
- Applicant: TOKYO ELECTRON LIMITED
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Fenwick & West LLP
- Priority: JPJP2019-093427 20190517
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/677 ; B65G47/90 ; H01L21/687

Abstract:
A vacuum transfer apparatus includes a vacuum chamber, a transfer robot, and a bellows. The vacuum chamber has a through-hole communicating with an outside. The transfer robot includes an arm unit disposed in the vacuum chamber to support a substrate, a support unit configured to support the arm unit while passing through the through-hole with a gap between the support unit and the through-hole, and a base unit disposed at the outside of the vacuum chamber to support the support unit. The bellows surrounds a periphery of the support unit and is sealed and attached to the arm unit and an inner wall of the vacuum chamber around the through-hole.
Information query
IPC分类: