Invention Grant
- Patent Title: Composite piezoelectric capacitor
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Application No.: US16417346Application Date: 2019-05-20
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Publication No.: US11217392B2Publication Date: 2022-01-04
- Inventor: Ryan M. Hatcher , Titash Rakshit , Jorge A. Kittl , Joon Goo Hong , Dharmendar Palle
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Lewis Roca Rothgerber Christie LLP
- Main IPC: H01L41/083
- IPC: H01L41/083 ; H01G4/12 ; H01L29/51 ; H01L29/78 ; H01G4/008

Abstract:
A circuit element. In some embodiments, the circuit element includes a first terminal, a second terminal, and a layered structure. The layered structure may include a first conductive layer connected to the first terminal, a first piezoelectric layer on the first conductive layer, a second piezoelectric layer on the first piezoelectric layer, and a second conductive layer connected to the second terminal. The first piezoelectric layer may have a first piezoelectric tensor and a first permittivity tensor, and the second piezoelectric layer may have a second piezoelectric tensor and a second permittivity tensor, one or both of the second piezoelectric tensor and a second permittivity tensor differing, respectively, from the first piezoelectric tensor and the first permittivity tensor.
Public/Granted literature
- US20200234881A1 COMPOSITE PIEZOELECTRIC CAPACITOR Public/Granted day:2020-07-23
Information query
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