Invention Grant
- Patent Title: Semiconductor device
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Application No.: US16959716Application Date: 2018-12-20
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Publication No.: US11217290B2Publication Date: 2022-01-04
- Inventor: Mikio Oka
- Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Applicant Address: JP Kanagawa
- Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Current Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Current Assignee Address: JP Kanagawa
- Agency: Chip Law Group
- Priority: JPJP2018-002844 20180111
- International Application: PCT/JP2018/046922 WO 20181220
- International Announcement: WO2019/138828 WO 20190718
- Main IPC: G11C11/16
- IPC: G11C11/16 ; H01L27/22

Abstract:
A semiconductor device of the present disclosure includes: a first gate electrode that includes a first main line section and one or a plurality of first sub line sections, in which the first main line section extends in a first direction in a first active region of a semiconductor substrate, and segments the first active region into a first region and a second region, and the one or the plurality of first sub line sections extends from the first main line section in a second direction intersecting the first direction in the first region, and segments the first region into a plurality of sub regions including a first sub region and a second sub region; a first memory element that includes a first terminal, and a second terminal coupled to the first sub region of the semiconductor substrate, and is configured to be set in a first resistive state or a second resistive state; and a second memory element that includes a first terminal, and a second terminal coupled to the second sub region of the semiconductor substrate, and is configured to be set in the first resistive state or the second resistive state.
Public/Granted literature
- US20200349993A1 SEMICONDUCTOR DEVICE Public/Granted day:2020-11-05
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