Invention Grant
- Patent Title: Photoresist system and method
-
Application No.: US16228977Application Date: 2018-12-21
-
Publication No.: US11215929B2Publication Date: 2022-01-04
- Inventor: Hung-Jui Kuo , De-Yuan Lu , Chen-Hua Yu , Ming-Tan Lee
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Slater Matsil, LLP
- Main IPC: G03F7/16
- IPC: G03F7/16

Abstract:
A photoresist apparatus and a method are provided. The photoresist apparatus includes a pre-baking apparatus. The pre-baking apparatus includes: a hot-plate, a first cover over the hot-plate, a second cover over the first cover, a first heating element extending along a topmost surface of the first cover, and a second heating element extending along a topmost surface of the second cover.
Information query
IPC分类: