Invention Grant
- Patent Title: Embedding apparatus
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Application No.: US16966431Application Date: 2019-01-29
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Publication No.: US11215539B2Publication Date: 2022-01-04
- Inventor: Akira Takehana
- Applicant: SAKURA SEIKI CO., LTD. , SAKURA FINETEK JAPAN CO., LTD.
- Applicant Address: JP Nagano; JP Tokyo
- Assignee: SAKURA SEIKI CO., LTD.,SAKURA FINETEK JAPAN CO., LTD.
- Current Assignee: SAKURA SEIKI CO., LTD.,SAKURA FINETEK JAPAN CO., LTD.
- Current Assignee Address: JP Nagano; JP Tokyo
- Agent William Thomas Babbitt, Esq.
- Priority: JPJP2018-016566 20180201
- International Application: PCT/JP2019/002912 WO 20190129
- International Announcement: WO2019/151224 WO 20190808
- Main IPC: G01N1/00
- IPC: G01N1/00 ; G01N1/36 ; G01N1/31

Abstract:
It is an object of the present invention to provide an embedding apparatus capable of selectively changing a thickness above a hand-rest part of a mechanism for placing a hand. As solving means, the embedding apparatus (10) according to the present invention configured to dispense and embed an embedding material into an embedding tray includes a cold spot (16) configured to cool the embedding tray, a hand-rest part (18) provided on each of left and right sides with the cold spot (16) interposed therebetween, and a wrist-rest part (24) detachably attached onto the hand-rest part (18).
Public/Granted literature
- US20210055190A1 EMBEDDING APPARATUS Public/Granted day:2021-02-25
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