Invention Grant
- Patent Title: Sensor device and electronic apparatus
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Application No.: US16743517Application Date: 2020-01-15
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Publication No.: US11215484B2Publication Date: 2022-01-04
- Inventor: Masayasu Sakuma , Yoshihiro Kobayashi , Shojiro Kitamura , Taketo Chino
- Applicant: Seiko Epson Corporation
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JP2011-154502 20110713
- Main IPC: G01D11/24
- IPC: G01D11/24 ; G01C19/5769 ; G01D11/30 ; G01C21/16
Abstract:
A sensor device includes a mounting member having fixation surfaces inside, and at least one electronic component directly or indirectly fixed to the fixation surfaces of the mounting member, and the mounting member constitutes a part of a casing for housing the electronic component. Further, the fixation surfaces are perpendicular to each other.
Public/Granted literature
- US20200149934A1 Sensor Device And Electronic Apparatus Public/Granted day:2020-05-14
Information query
