Invention Grant
- Patent Title: Fixing device for double sided heat sink and associated heat dissipating system
-
Application No.: US16737430Application Date: 2020-01-08
-
Publication No.: US11215409B2Publication Date: 2022-01-04
- Inventor: Haifang Zhai , Hendry Wu , David Dong , Yujie Zhou
- Applicant: EMC IP Holding Company LLC
- Applicant Address: US MA Hopkinton
- Assignee: EMC IP Holding Company LLC
- Current Assignee: EMC IP Holding Company LLC
- Current Assignee Address: US MA Hopkinton
- Agency: Ryan, Mason & Lewis, LLP
- Priority: CN201711025185.1 20171027
- Main IPC: F28F19/00
- IPC: F28F19/00 ; H05K7/20 ; H05K1/02 ; H05K1/18 ; H01L23/427 ; H01L23/40 ; F28D15/02

Abstract:
Embodiments of the present disclosure relate to a fixing device for a double-sided heat sink and an associated heat dissipating system. There is exemplarily provided a fixing device for mounting the double-sided heat sink on a carrier. The fixing device comprises: a first holder including a first cylindrically-shaped rod, wherein the first cylindrically-shaped rod can pass through a first cooling portion of the double-sided heat sink and a mounting hole of the carrier to fix the first cooling portion to a first side of the carrier, and the first cylindrically-shaped rod comprises a through-hole extending along a longitudinal direction; and a second holder including a second cylindrically-shaped rod, wherein the second cylindrically-shaped rod can pass through a mounting hole of a second cooling portion of the double-sided heat sink and the through-hole of the first holder, such that the second holder is coupled with the first holder to fix the second cooling portion to a second side of the carrier opposite to the first side.
Information query