Invention Grant
- Patent Title: Vacuum pump control apparatus and vacuum pump, and assembly method of vacuum pump control apparatus
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Application No.: US16345053Application Date: 2017-10-31
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Publication No.: US11215186B2Publication Date: 2022-01-04
- Inventor: Takuya Okada
- Applicant: Edwards Japan Limited
- Applicant Address: JP Yachiyo
- Assignee: Edwards Japan Limited
- Current Assignee: Edwards Japan Limited
- Current Assignee Address: JP Yachiyo
- Agency: Shumaker & Sieffert, P.A.
- Priority: JPJP2016-216523 20161104
- International Application: PCT/JP2017/039456 WO 20171031
- International Announcement: WO2018/084160 WO 20180511
- Main IPC: H05K7/14
- IPC: H05K7/14 ; F04D19/04 ; H05K7/20

Abstract:
A vacuum pump control apparatus may include a plurality of circuit boards including a first circuit board and a second circuit board which constitute a control circuit that controls a vacuum pump main body; a housing having an internal space in which the plurality of the circuit boards are arranged, in which an upper side of the housing is open; a heat radiating plate having a bottom surface portion to which the first circuit board is mounted so as to enable heat radiation and which is arranged on the housing so as to close the opening of the housing; and a board fixing means which fixes the second circuit board to a board mounting seat portion of the housing so as to enable heat radiation.
Public/Granted literature
- US20190277296A1 VACUUM PUMP CONTROL APPARATUS AND VACUUM PUMP, AND ASSEMBLY METHOD OF VACUUM PUMP CONTROL APPARATUS Public/Granted day:2019-09-12
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