Invention Grant
- Patent Title: Semiconductor structure and method for forming the same
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Application No.: US16744459Application Date: 2020-01-16
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Publication No.: US11139379B2Publication Date: 2021-10-05
- Inventor: Zhi-Chang Lin , Shih-Cheng Chen , Kuo-Cheng Chiang , Pei-Hsun Wang , Chih-Hao Wang
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Main IPC: H01L29/417
- IPC: H01L29/417 ; H01L29/06 ; H01L29/423 ; H01L29/40 ; H01L21/8238

Abstract:
A semiconductor structure is provided. The semiconductor structure includes nanostructures over a substrate, a gate stack around the nanostructures, a gate spacer layer alongside the gate stack, an inner spacer layer between the gate spacer layer and the nanostructures, a source/drain feature adjoining the nanostructures, a contact plug over the source/drain feature, and a silicon germanium layer along the surface of the source/drain feature and between the contact plug and the inner spacer layer.
Public/Granted literature
- US20210226020A1 SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME Public/Granted day:2021-07-22
Information query
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