Invention Grant
- Patent Title: Substrate processing device and substrate transfer method
-
Application No.: US16639860Application Date: 2018-08-10
-
Publication No.: US11139185B2Publication Date: 2021-10-05
- Inventor: Tsutomu Hiroki
- Applicant: TOKYO ELECTRON LIMITED
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Nath, Goldberg & Meyer
- Agent Jerald L. Meyer; Tanya E. Harkins
- Priority: JPJP2017-160331 20170823
- International Application: PCT/JP2018/030037 WO 20180810
- International Announcement: WO2019/039316 WO 20190228
- Main IPC: H01L21/67
- IPC: H01L21/67 ; B65G47/91 ; H01L21/687

Abstract:
There is provided a load lock chamber including: a plurality of stages on which a plurality of first substrates that are loaded at once by means of a second transfer mechanism are respectively mounted; a moving mechanism which, in a state in which the plurality of first substrates are respectively mounted on the plurality of stages, moves the plurality of stages to narrow the interval between the plurality of stages; and a rotating mechanism which, when the plurality of first substrates are unloaded one by one by means of a first transfer mechanism, rotates the plurality of stages with the narrowed interval about an axis, and causes the plurality of first substrates successively to become closer to the first transfer mechanism around the axis.
Information query
IPC分类: