Invention Grant
- Patent Title: Electronic component
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Application No.: US16193508Application Date: 2018-11-16
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Publication No.: US11139113B2Publication Date: 2021-10-05
- Inventor: Heung Kil Park , Gu Won Ji , Se Hun Park , Young Ghyu Ahn
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2018-0051916 20180504
- Main IPC: H01G4/248
- IPC: H01G4/248 ; H01G4/30 ; H01G4/232 ; H01G4/008 ; H01G4/12

Abstract:
An electronic component includes: a capacitor body; first and second external electrodes disposed on both ends of the capacitor body in a length direction; and first and second connection terminals disposed on a mounting surface of the capacitor body and electrically connected to the first and second external electrodes, respectively, and having first and second cut portions on surfaces facing each other in the length direction of the capacitor body, respectively.
Public/Granted literature
- US20190341189A1 ELECTRONIC COMPONENT Public/Granted day:2019-11-07
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