Invention Grant
- Patent Title: Coil electronic component
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Application No.: US16181722Application Date: 2018-11-06
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Publication No.: US11139108B2Publication Date: 2021-10-05
- Inventor: Kang Wook Bong , Byeong Cheol Moon , Boum Seock Kim
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2018-0060333 20180528
- Main IPC: H01F27/28
- IPC: H01F27/28 ; H01F27/34 ; H01F27/32 ; H01F41/04 ; H01F27/29

Abstract:
A coil electronic component includes a body including a support member, an internal coil supported by the support member, and an encapsulant encapsulating the support member and the internal coil, and external electrodes disposed on an external surface of the body and connected to the internal coil, wherein the internal coil includes a plurality of coil patterns, each of the plurality of coil patterns includes a lower coil pattern in contact with the support member and an upper coil pattern on the lower coil pattern, a line width and a thickness of the lower coil pattern are uniform in along the internal coil, and a line width and a thickness of the upper coil pattern are increased in a direction from the center of the internal coil to the outermost portion of the internal coil.
Information query