Invention Grant
- Patent Title: Resistor component
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Application No.: US16864582Application Date: 2020-05-01
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Publication No.: US11139092B2Publication Date: 2021-10-05
- Inventor: Hyung Min Kim , Su Rim Bae
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2019-0172618 20191223
- Main IPC: H01C7/00
- IPC: H01C7/00 ; H01C17/065 ; H01C1/01 ; H01C1/14

Abstract:
A resistor component includes an insulating substrate; a resistance layer disposed on a first surface of the insulating layer; and first and second terminals, spaced apart from each other, disposed on an external surface of the insulating substrate and connected to the resistance layer; a marking pattern portion disposed on a second surface of the insulating layer, opposing the first surface of the insulating substrate; and a marking protection layer disposed on the second surface and covering the marking pattern portion.
Public/Granted literature
- US20210193353A1 RESISTOR COMPONENT Public/Granted day:2021-06-24
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