Invention Grant
- Patent Title: Semiconductor structure with buried conductive line and method for forming the same
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Application No.: US16589263Application Date: 2019-10-01
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Publication No.: US11114366B2Publication Date: 2021-09-07
- Inventor: Jhon-Jhy Liaw
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: McClure, Qualey & Rodack, LLP
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L29/06 ; H01L27/092 ; H01L21/768 ; H01L21/8238

Abstract:
A semiconductor structure is provided. The semiconductor structure includes a first well region over a substrate, and an isolation structure over the first well region. The semiconductor structure also includes a first transistor over the first well region, and a first buried conductive line over the first well region and electrically connected to a source structure of the first transistor. A top surface of the first buried conductive line is substantially level with or lower than a top surface of the isolation structure.
Public/Granted literature
- US20210098338A1 SEMICONDUCTOR STRUCTURE WITH BURIED CONDUCTIVE LINE AND METHOD FOR FORMING THE SAME Public/Granted day:2021-04-01
Information query
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