Invention Grant
- Patent Title: 3D-printed protective shell structures with support columns for stress sensitive circuits
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Application No.: US16724681Application Date: 2019-12-23
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Publication No.: US11082028B2Publication Date: 2021-08-03
- Inventor: James Cooper Wainerdi , Luu Nguyen , Alexander Harvey Scheuermann , Matthew David Romig
- Applicant: Texas Instruments Incorporated
- Applicant Address: US TX Dallas
- Assignee: Texas Instruments Incorporated
- Current Assignee: Texas Instruments Incorporated
- Current Assignee Address: US TX Dallas
- Agent Dawn Jos; Charles A. Brill; Frank D. Cimino
- Main IPC: H03H9/10
- IPC: H03H9/10 ; H01L23/495 ; H01L23/31 ; B81B7/00 ; H01L23/18 ; B29C64/00 ; B33Y80/00 ; H01L21/02 ; H01L23/433 ; H01L41/053 ; H01L41/23
Abstract:
In one aspect of the disclosure, a semiconductor package is disclosed. The semiconductor package includes a lead frame. A semiconductor die is attached to a first side of the lead frame. A protective shell covers at least a first portion of the first surface of the semiconductor die. The protective shell comprises of ink residue. A layer of molding compound covers an outer surface of the protective shell and exposed portion of the first surface of the semiconductor die. A cavity space is within an inner space of the protective shell and the first portion of the top surface of the semiconductor die.
Information query
