Invention Grant
- Patent Title: Joined body of piezoelectric material substrate and support substrate
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Application No.: US17097129Application Date: 2020-11-13
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Publication No.: US11082026B2Publication Date: 2021-08-03
- Inventor: Yuji Hori , Tatsuro Takagaki
- Applicant: NGK INSULATORS, LTD.
- Applicant Address: JP Nagoya
- Assignee: NGK INSULATORS, LTD.
- Current Assignee: NGK INSULATORS, LTD.
- Current Assignee Address: JP Nagoya
- Agency: Flynn Thiel, P.C.
- Priority: JPJP2018-094524 20180516
- Main IPC: H03H9/02
- IPC: H03H9/02 ; H01L41/312 ; H03H9/25 ; H01L41/337 ; H01L41/187 ; C30B33/06 ; C23C14/10 ; C23C14/08 ; C30B29/30 ; H01L41/313

Abstract:
A bonded body includes a supporting substrate; a piezoelectric material substrate composed of a material selected from the group consisting of lithium niobate, lithium tantalate and lithium niobate-lithium tantalate; and a bonding layer bonding the supporting substrate and the piezoelectric material substrate and contacting a main surface of the piezoelectric material substrate. The bonding layer includes a void extending from the piezoelectric material substrate toward the supporting substrate. A ratio (t2/t1) of a width t2 at an end of the void on a side of the supporting substrate with respect to a width t1 at an end of the void on a side of the piezoelectric material substrate is 0.8 or lower.
Public/Granted literature
- US20210067130A1 JOINED BODY OF PIEZOELECTRIC MATERIAL SUBSTRATE AND SUPPORT SUBSTRATE Public/Granted day:2021-03-04
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