Invention Grant
- Patent Title: Method and sleeve for connecting power-electronics structural elements and printed circuit boards
-
Application No.: US16696379Application Date: 2019-11-26
-
Publication No.: US11081818B2Publication Date: 2021-08-03
- Inventor: Stefan Goetz
- Applicant: Dr. Ing. h.c. F. Porsche Aktiengesellschaft
- Applicant Address: DE Stuttgart
- Assignee: Dr. Ing. h.c. F. Porsche Aktiengesellschaft
- Current Assignee: Dr. Ing. h.c. F. Porsche Aktiengesellschaft
- Current Assignee Address: DE Stuttgart
- Agent Gerald E. Hespos; Michael J. Porco; Matthew T. Hespos
- Priority: DE102018129878.1 20181127
- Main IPC: H05K7/00
- IPC: H05K7/00 ; H01R12/55 ; H05K3/32 ; H05K1/18 ; H01M10/42

Abstract:
Mechanical and electrical connection is established between a power-electronics structural element and a circuit board. The circuit board has a bore and an electrical contact area encircles the bore. The power-electronics structural element has a mechanical fastening option and an electrical contact area encircles this fastening option at a point to be connected to the circuit board. A cylinder with a head on one end is inserted into the bore of the circuit board to achieve the mechanical connection, and a sleeve formed from an electrically conductive material surrounds the cylinder. Electrical contact areas of the power-electronics structural element and the circuit board are connected electrically by the sleeve. The mechanical connection is formed by an interlocking connection of the cylinder and the fastening option of the power-electronics structural element.
Public/Granted literature
- US20200169014A1 METHOD AND SLEEVE FOR CONNECTING POWER-ELECTRONICS STRUCTURAL ELEMENTS AND PRINTED CIRCUIT BOARDS Public/Granted day:2020-05-28
Information query