Invention Grant
- Patent Title: Semiconductor device with a programmable contact and method for fabricating the same
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Application No.: US16734869Application Date: 2020-01-06
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Publication No.: US11081562B2Publication Date: 2021-08-03
- Inventor: Chin-Ling Huang
- Applicant: NANYA TECHNOLOGY CORPORATION
- Applicant Address: TW New Taipei
- Assignee: NANYA TECHNOLOGY CORPORATION
- Current Assignee: NANYA TECHNOLOGY CORPORATION
- Current Assignee Address: TW New Taipei
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Main IPC: H01L29/423
- IPC: H01L29/423 ; H01L21/28 ; H01L29/51 ; H01L29/49 ; H01L29/417 ; H01L21/8234 ; H01L21/8238 ; H01L27/092

Abstract:
The present application discloses a semiconductor device and a method for fabricating the semiconductor device. The semiconductor device includes a substrate, a gate stack positioned on the substrate, a plurality of programmable contacts positioned on the gate stack, a pair of heavily-doped regions positioned adjacent to two sides of the gate stack and in the substrate, and a plurality of first contacts positioned on the pair of heavily-doped regions. A width of the plurality of programmable contacts is less than a width of the plurality of first contacts.
Public/Granted literature
- US20210210611A1 SEMICONDUCTOR DEVICE WITH A PROGRAMMABLE CONTACT AND METHOD FOR FABRICATING THE SAME Public/Granted day:2021-07-08
Information query
IPC分类: