A photosensitive module is provided, which can be disposed in an electronic device for receiving light passing through a lens in the electronic device, including a base assembly, an image sensor, a first plastic member and a transparent plate. The base assembly includes a substrate, and the substrate has a main body including a metal material. The image sensor is disposed on the base assembly and adjacent to the main body of the substrate. The first plastic member is connected to the base assembly and configured to protect the image sensor. The transparent plate is located on the first plastic member. When the photosensitive module receives the light passing through the lens, the light passes through the transparent plate to the image sensor.