Invention Grant
- Patent Title: Semiconductor device and method of manufacturing thereof
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Application No.: US16680388Application Date: 2019-11-11
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Publication No.: US11081470B2Publication Date: 2021-08-03
- Inventor: Won Geol Lee , Won Chul Do , Ji Hun Yi
- Applicant: Amkor Technology Singapore Holding Pte. Ltd.
- Applicant Address: SG Valley Point
- Assignee: Amkor Technology Singapore Holding Pte. Ltd.
- Current Assignee: Amkor Technology Singapore Holding Pte. Ltd.
- Current Assignee Address: SG Valley Point
- Agency: McAndrews, Held & Malloy, Ltd.
- Main IPC: H01L25/065
- IPC: H01L25/065 ; H01L23/538 ; H01L25/00 ; H01L23/31 ; H01L23/498
Abstract:
Various aspects of this disclosure provide a semiconductor device and a method of manufacturing a semiconductor device. As a non-limiting example, various aspects of this disclosure provide a semiconductor device comprising a stacked die structure and a method of manufacturing thereof.
Public/Granted literature
- US20200219849A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF Public/Granted day:2020-07-09
Information query
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