Invention Grant
- Patent Title: Circuit device
-
Application No.: US16612890Application Date: 2018-04-26
-
Publication No.: US11081431B2Publication Date: 2021-08-03
- Inventor: Jun Ikeda
- Applicant: AutoNetworks Technologies, Ltd. , Sumitomo Wiring Systems, Ltd. , Sumitomo Electric Industries, Ltd.
- Applicant Address: JP Mie; JP Mie; JP Osaka
- Assignee: AutoNetworks Technologies, Ltd.,Sumitomo Wiring Systems, Ltd.,Sumitomo Electric Industries, Ltd.
- Current Assignee: AutoNetworks Technologies, Ltd.,Sumitomo Wiring Systems, Ltd.,Sumitomo Electric Industries, Ltd.
- Current Assignee Address: JP Mie; JP Mie; JP Osaka
- Agency: Honigman LLP
- Priority: JPJP2017-098196 20170517
- International Application: PCT/JP2018/016919 WO 20180426
- International Announcement: WO2018/211935 WO 20181122
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/32 ; H01L23/367 ; H01R4/34

Abstract:
A circuit device includes a first conductive plate and a second conductive plate each having a belt-shaped portion arranged side-by-side with each other, a third conductive plate having a belt-shaped portion is arranged side-by-side with and spaced apart from the other side portion of the first conductive plate, a first circuit component having a first terminal connected to the first conductive plate and a second terminal connected to the second conductive plate, a second circuit component having a first terminal connected to the first conductive plate and a second terminal connected to the third conductive plate, a first external connection portion provided at the belt-shaped portion of the first conductive plate, and a second external connection portion provided at the belt-shaped portion of the second conductive plate or a third external connection portion provided at the belt-shaped portion of the third conductive plate.
Public/Granted literature
- US20200168532A1 CIRCUIT DEVICE Public/Granted day:2020-05-28
Information query
IPC分类: