Invention Grant
- Patent Title: Substrate cleaning apparatus and substrate cleaning method
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Application No.: US15689071Application Date: 2017-08-29
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Publication No.: US11081373B2Publication Date: 2021-08-03
- Inventor: Tomoatsu Ishibashi
- Applicant: Ebara Corporation
- Applicant Address: JP Tokyo
- Assignee: Ebara Corporation
- Current Assignee: Ebara Corporation
- Current Assignee Address: JP Tokyo
- Agency: Leydig, Voit & Mayer, Ltd.
- Priority: JPJP2016-171398 20160902
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/687 ; B08B3/02

Abstract:
According to one embodiment, a substrate cleaning apparatus that cleans a substrate while rotating the substrate, the substrate cleaning apparatus includes: a first cleaning liquid supplier that sprays cleaning liquid in a spray shape at a first spraying angle toward a center of the substrate; and a second cleaning liquid supplier that sprays cleaning liquid in a spray shape at a second spraying angle greater than the first spraying angle toward an area between the center of the substrate and an edge of the substrate.
Public/Granted literature
- US20180068877A1 SUBSTRATE CLEANING APPARATUS AND SUBSTRATE CLEANING METHOD Public/Granted day:2018-03-08
Information query
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