Invention Grant
- Patent Title: Electronic component
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Application No.: US16114905Application Date: 2018-08-28
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Publication No.: US11081276B2Publication Date: 2021-08-03
- Inventor: Jae Young Na
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2018-0019408 20180219
- Main IPC: H01G4/005
- IPC: H01G4/005 ; H01G4/38 ; H01G4/33 ; H01G4/30 ; H01G4/12 ; H01L49/02

Abstract:
An electronic component includes: a first frame, including a first support portion and a plurality of first extension portions, extended from the first support portion in a first direction; a second frame, including a second support portion disposed to face the first support portion and a plurality of second extension portions, extended from the second support portion in a second direction opposite to the first direction and disposed to alternate with and be spaced apart from the first extension portions in the first direction; and a plurality of capacitors disposed on first and second extension portions adjacent to each other by a predetermined interval so that first and second external electrodes are adhered thereto, respectively.
Public/Granted literature
- US20190259533A1 ELECTRONIC COMPONENT Public/Granted day:2019-08-22
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