An inspection device comprises: a detecting unit that is connected to a plurality of semiconductor chips having mutually different rates of change of electrical resistance with respect to stress loading direction, and that detects an electrical resistance value of each semiconductor chip from electric current flowing in each semiconductor chip; a first memory unit that is used to hold model data meant for converting an electrical resistance value into a characteristic value indicating at least either temperature, or stress, or strain; a converting unit that converts the electrical resistance value of each semiconductor chip as detected by the detecting unit into the characteristic value using the model data held in the first memory unit; and a second memory unit that is used to store the characteristic value, which is obtained by conversion by the converting unit, as time-series data for each of the plurality of semiconductor chips.