Invention Grant
- Patent Title: Component supply device
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Application No.: US16305329Application Date: 2016-05-31
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Publication No.: US11032957B2Publication Date: 2021-06-08
- Inventor: Shinji Ichino , Tsuyoshi Hamane , Toru Matsumoto
- Applicant: FUJI CORPORATION
- Applicant Address: JP Chiryu
- Assignee: FUJI CORPORATION
- Current Assignee: FUJI CORPORATION
- Current Assignee Address: JP Chiryu
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- International Application: PCT/JP2016/065968 WO 20160531
- International Announcement: WO2017/208323 WO 20171207
- Main IPC: B65G47/14
- IPC: B65G47/14 ; B65G47/12 ; B65G47/00 ; H05K13/02 ; H05K13/04 ; H05K13/08

Abstract:
A loose component supply device including: component support member 150 configured to support multiple components in a scattered state; component collection container 180 configured to collect the components supported on the component support member via an opening in the component collection container; and a container oscillating device configured to scatter the components collected inside the component collection container onto the component support surface by swinging the component collection container such that the opening of the collection container faces the component support member. By this, because components are scattered on the component support member directly form the component collection container, the cycle time is shortened, thereby improving practicality of a component supply device.
Public/Granted literature
- US20200323110A1 COMPONENT SUPPLY DEVICE Public/Granted day:2020-10-08
Information query
IPC分类: