Invention Grant
- Patent Title: Method for deploying liquid cooling solution in an air-cooled data center room
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Application No.: US16587924Application Date: 2019-09-30
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Publication No.: US11032949B2Publication Date: 2021-06-08
- Inventor: Tianyi Gao
- Applicant: Baidu USA LLC
- Applicant Address: US CA Sunnyvale
- Assignee: Baidu USA LLC
- Current Assignee: Baidu USA LLC
- Current Assignee Address: US CA Sunnyvale
- Agency: Womble Bond Dickinson (US) LLP
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H05K7/14

Abstract:
An electronic rack includes an array of server shelves inserted into at least some of a plurality of standard slots of the electronic rack. Each server shelf contains one or more servers and each server includes one or more processors. At least some of the processors are mounted on cold plates for liquid cooling. The electronic rack further includes a liquid manifold shelf inserted into one of the standard slots. The liquid manifold shelf includes a pair of an upstream supply port and an upstream return port and further includes one or more pairs of a downstream inlet port and a downstream outlet port. The upstream supply port is coupled to a facility liquid supply line to receive cooling liquid from an external cooling liquid source and the upstream return port to return the cooling liquid back to the external cooling liquid source. At least some of the pairs of the downstream inlet port and downstream outlet port are coupled to the cold plates of some of the server shelves to circulate the cooling liquid to provide liquid cooling to the corresponding processors. A multifunction sectional pipes are assembled for connecting the fluid loops.
Public/Granted literature
- US20210100134A1 METHOD FOR DEPLOYING LIQUID COOLING SOLUTION IN AN AIR-COOLED DATA CENTER ROOM Public/Granted day:2021-04-01
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