Invention Grant
- Patent Title: Speaker module
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Application No.: US16525582Application Date: 2019-07-30
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Publication No.: US11032636B2Publication Date: 2021-06-08
- Inventor: Zhichen Chen , Wei Wei
- Applicant: AAC Technologies Pte. Ltd.
- Applicant Address: SG Singapore
- Assignee: AAC Technologies Pte. Ltd.
- Current Assignee: AAC Technologies Pte. Ltd.
- Current Assignee Address: SG Singapore
- Agency: W&G Law Group LLP
- Priority: CN201810876526.4 20180803
- Main IPC: H04R1/28
- IPC: H04R1/28

Abstract:
A speaker module includes a housing and a speaker unit accommodated in the housing. The housing includes a bottom wall, a top wall, and a side wall. The speaker module further includes at least one first isolating member connected to the bottom wall and the top wall respectively. The first isolating member isolates an accommodating space into an accommodating cavity and a first filling cavity. The first isolating member includes a first metal frame and an air-permeable isolating mesh attached to the first metal frame. The first metal frame includes a first top border and a first bottom border. The first top border and/or the first bottom border is provided with a protrusion portion, and the protrusion portion abuts against the top wall or the bottom wall and is connected to the top wall or the bottom wall by spot welding.
Public/Granted literature
- US20200045409A1 SPEAKER MODULE Public/Granted day:2020-02-06
Information query
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