Invention Grant
- Patent Title: Semiconductor device, manufacturing method thereof, and electronic device including the same
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Application No.: US16779067Application Date: 2020-01-31
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Publication No.: US11031469B2Publication Date: 2021-06-08
- Inventor: Huilong Zhu
- Applicant: INSTITUTE OF MICROELECTRONICS, CHINESE ACADEMY OF SCIENCES
- Applicant Address: CN Beijing
- Assignee: INSTITUTE OF MICROELECTRONICS, CHINESE ACADEMY OF SCIENCES
- Current Assignee: INSTITUTE OF MICROELECTRONICS, CHINESE ACADEMY OF SCIENCES
- Current Assignee Address: CN Beijing
- Agency: Hamre, Schumann, Mueller & Larson, P.C.
- Priority: CN201910108694.3 20190203
- Main IPC: H01L29/10
- IPC: H01L29/10 ; H01L21/22 ; H01L21/8234 ; H01L29/78

Abstract:
A semiconductor device, a manufacturing method thereof, and an electronic device including the same are provided. According to an embodiment, the semiconductor device may include a substrate; a first source/drain region, a channel region and a second source/drain region stacked on the substrate in sequence and contiguous to each other, and a gate stack formed surrounding a periphery of the channel region; wherein spacers are respectively provided between the gate stack and the first source/drain region and between the gate stack and the second source/drain region in a form of surrounding the periphery of the channel region.
Public/Granted literature
- US20200251557A1 SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, AND ELECTRONIC DEVICE INCLUDING THE SAME Public/Granted day:2020-08-06
Information query
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