- Patent Title: Semiconductor device and method of producing semiconductor device
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Application No.: US16802612Application Date: 2020-02-27
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Publication No.: US11031408B2Publication Date: 2021-06-08
- Inventor: Taku Shibaguchi
- Applicant: LAPIS SEMICONDUCTOR CO., LTD.
- Applicant Address: JP Kanagawa
- Assignee: LAPIS SEMICONDUCTOR CO., LTD.
- Current Assignee: LAPIS SEMICONDUCTOR CO., LTD.
- Current Assignee Address: JP Kanagawa
- Agency: Volentine, Whitt & Francos, PLLC
- Priority: JPJP2019-069319 20190329
- Main IPC: G11C11/34
- IPC: G11C11/34 ; H01L27/11526 ; G11C16/26 ; H01L27/11521 ; H01L29/08 ; H01L29/423 ; G11C16/04 ; H01L29/66 ; G11C16/10 ; H01L21/28 ; H01L21/02 ; H01L21/311 ; H01L21/762 ; H01L21/3105 ; H01L21/265

Abstract:
A semiconductor device includes a semiconductor substrate, and a nonvolatile memory cell disposed on the semiconductor substrate. The nonvolatile memory cell includes a field-effect transistor for data writing, and a field-effect transistor for data readout that is adjacent to the field-effect transistor for data writing. Each of the field-effect transistor for data writing and the field-effect transistor for data readout includes a gate insulating film formed on the semiconductor substrate, a floating gate formed on the gate insulating film, and diffusion layers configuring a source region and a drain region on respective sides of the floating gate viewed in the thickness direction of the semiconductor substrate. The thickness of the gate insulating film of the field-effect transistor for data readout, and the thickness of the gate insulating film of the field-effect transistor for data writing, are different.
Public/Granted literature
- US20200312860A1 SEMICONDUCTOR DEVICE AND METHOD OF PRODUCING SEMICONDUCTOR DEVICE Public/Granted day:2020-10-01
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