Invention Grant
- Patent Title: Semiconductor device and manufacturing method of the same
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Application No.: US16826746Application Date: 2020-03-23
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Publication No.: US11031399B2Publication Date: 2021-06-08
- Inventor: Masahiro Mitsunaga
- Applicant: SONY CORPORATION
- Applicant Address: JP Tokyo
- Assignee: SONY CORPORATION
- Current Assignee: SONY CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Chip Law Group
- Priority: JP2012-112033 20120516
- Main IPC: H01L27/095
- IPC: H01L27/095 ; H01L29/778 ; H01L29/66 ; H01L29/205 ; H01L21/8252 ; H01L41/08 ; H01L41/25 ; H01L21/28 ; H01L29/10

Abstract:
A semiconductor device includes a buffer layer formed with a semiconductor adapted to produce piezoelectric polarization, and a channel layer stacked on the buffer layer, wherein a two-dimensional hole gas, generated in the channel layer by piezoelectric polarization of the buffer layer, is used as a carrier of the channel layer. In a complementary semiconductor device, the semiconductor device described above and an n-type field effect transistor are formed on the same compound semiconductor substrate. Further, a semiconductor device manufacturing method includes forming a compound semiconductor base portion, forming a buffer layer on the base portion, forming a channel layer on the buffer layer, forming a date on the channel layer, and forming a drain and source with the gate therebetween on the channel layer.
Public/Granted literature
- US20200227412A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME Public/Granted day:2020-07-16
Information query
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