Invention Grant
- Patent Title: Semiconductor structure and driving chip
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Application No.: US16531270Application Date: 2019-08-05
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Publication No.: US11031388B2Publication Date: 2021-06-08
- Inventor: Yicheng Du , Meng Wang , Hui Yu
- Applicant: Silergy Semiconductor Technology (Hangzhou) LTD
- Applicant Address: CN Hangzhou
- Assignee: Silergy Semiconductor Technology (Hangzhou) LTD
- Current Assignee: Silergy Semiconductor Technology (Hangzhou) LTD
- Current Assignee Address: CN Hangzhou
- Agent Michael C. Stephens, Jr.
- Priority: CN201810940876.2 20180817
- Main IPC: H01L27/06
- IPC: H01L27/06 ; H01L21/761 ; H02M1/08 ; H03K17/687

Abstract:
A semiconductor structure can include: a semiconductor substrate having a first region, a second region, and an isolation region disposed between the first and second regions; an isolation structure located in the isolation region, where the isolation structure comprises a first isolation ring having a first doping type, and a second isolation ring having a second doping type, where the first isolation ring is configured to absorb first carriers flowing from the first region to the second region, and where the second isolation ring is configured to absorb second carriers flowing from the second region to the first region; and a lateral blocking component in the isolation structure, where the lateral blocking component is configured to block a lateral flow of the first and second carriers, in order to increase a flow path of the first and second carriers in the semiconductor substrate.
Public/Granted literature
- US20200058643A1 SEMICONDUCTOR STRUCTURE AND DRIVING CHIP Public/Granted day:2020-02-20
Information query
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