Invention Grant
- Patent Title: Semiconductor device including dummy pull-down wire bonds
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Application No.: US16398511Application Date: 2019-04-30
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Publication No.: US11031372B2Publication Date: 2021-06-08
- Inventor: Han-Shiao Chen , Chih-Chin Liao , Chin-Tien Chiu
- Applicant: WESTERN DIGITAL TECHNOLOGIES, INC.
- Applicant Address: US CA San Jose
- Assignee: WESTERN DIGITAL TECHNOLOGIES, INC.
- Current Assignee: WESTERN DIGITAL TECHNOLOGIES, INC.
- Current Assignee Address: US CA San Jose
- Agency: Vierra Magen Marcus LLP
- Priority: CN201810418341.9 20180504
- Main IPC: H01L25/065
- IPC: H01L25/065 ; H01L23/00
Abstract:
A semiconductor device is disclosed including a stack of semiconductor die on a substrate, wherein a semiconductor die in the stack is wire bonded to the substrate using dummy wire bonds. Each dummy wire bond has a stiffness so that together, the dummy wire bonds effectively pull and/or hold down the die stack against the substrate.
Public/Granted literature
- US20190341366A1 SEMICONDUCTOR DEVICE INCLUDING DUMMY PULL-DOWN WIRE BONDS Public/Granted day:2019-11-07
Information query
IPC分类:
