A bonding apparatus includes a movable light guide, a first capture, a second capture, a detector, an aligner, and a mover. When the movable light guide is positioned between a chip and a board, an image of the chip is made incident from a first incident port and emitted from a first emission port, and an image of a bonding position of the board is made incident from a second incident port and emitted from a second emission port. The first capture images the image of the chip emitted from the first emission port. The second capture images the bonding position emitted from the second emission port. The detector detects a relative positional deviation of the chip and the bonding position. The aligner relatively moves a bonding tool and a stage. The mover advances and retreats the movable light guide.