Invention Grant
- Patent Title: Physical vapor deposition (PVD) electrostatic chuck with improved thermal coupling for temperature sensitive processes
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Application No.: US16213816Application Date: 2018-12-07
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Publication No.: US11031273B2Publication Date: 2021-06-08
- Inventor: Bonnie T Chia , Ross Marshall , Tomoharu Matsushita , Cheng-Hsiung Tsai
- Applicant: APPLIED MATERIALS, INC.
- Applicant Address: US CA Santa Clara
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: US CA Santa Clara
- Agency: Moser Taboada
- Main IPC: H01L21/683
- IPC: H01L21/683 ; H01L21/67 ; F24F3/00 ; H02N13/00

Abstract:
Embodiments of an electrostatic chuck are provided herein. In some embodiments an electrostatic chuck includes an electrode, a dielectric body having a disk shape and covering the electrode, the dielectric body including a central region and a peripheral region, and the dielectric body including a lower surface having a central opening and an upper surface having a first opening in the central region and a plurality of second openings in the peripheral region, wherein the upper surface includes a plurality of protrusions and a diameter of each of the plurality of second openings is greater than 25.0 mils, and gas distribution channels that extend from the lower surface to the upper surface to define a plenum within the dielectric body.
Public/Granted literature
Information query
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