Invention Grant
- Patent Title: Passive components for electronic circuits using conformal deposition on a scaffold
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Application No.: US15508453Application Date: 2015-09-02
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Publication No.: US11031179B2Publication Date: 2021-06-08
- Inventor: Juan M. Rivas Davila , Wei Liang , Luke C. Raymond
- Applicant: The Board of Trustees of the Leland Stanford Junior University
- Applicant Address: US CA Palo Alto
- Assignee: The Board of Trustees of the Leland Stanford Junior University
- Current Assignee: The Board of Trustees of the Leland Stanford Junior University
- Current Assignee Address: US CA Palo Alto
- Agency: Crawford Maunu PLLC
- International Application: PCT/US2015/048140 WO 20150902
- International Announcement: WO2016/036854 WO 20160310
- Main IPC: H01F7/06
- IPC: H01F7/06 ; H01F41/04 ; H01F17/06
Abstract:
Precision fabrication of 3D objects is used for fabricating passive electrical components. A 3D scaffold is fabricated and then electrically conductive and/or insulating layers are deposited on the scaffold to form the electrical component.
Public/Granted literature
- US20170287633A1 Passive components for electronic circuits using conformal deposition on a scaffold Public/Granted day:2017-10-05
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