Invention Grant
- Patent Title: Method of changing a switching module using pressure-applying device
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Application No.: US16279451Application Date: 2019-02-19
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Publication No.: US11026341B2Publication Date: 2021-06-01
- Inventor: Teagsun Jung
- Applicant: LSIS CO., LTD.
- Applicant Address: KR Anyang-si
- Assignee: LSIS CO., LTD.
- Current Assignee: LSIS CO., LTD.
- Current Assignee Address: KR Anyang-si
- Agency: K&L Gates LLP
- Priority: KR10-2018-0037096 20180330
- Main IPC: H05K7/12
- IPC: H05K7/12 ; H01L29/74 ; H02J3/18 ; H05K7/20 ; H01L23/40 ; H01L21/50 ; H05K7/14 ; H01L25/00 ; H01L25/11
Abstract:
A switching module may include a plurality of cooling plates stacked along a vertical direction, a switch disposed between the cooling plates, a first supporting member disposed below the lowermost cooling plate, a second supporting member disposed above the uppermost cooling plate, first and second pressing support portions disposed between the lowermost cooling plate and the first supporting member, and a pressing member disposed between the uppermost cooling plate and the second supporting member.
Public/Granted literature
- US20190307011A1 PRESSURE-APPLYING DEVICE FOR A SWITCHING MODULE AND METHOD OF CHANGING A SWITCHING MODULE USING THE SAME Public/Granted day:2019-10-03
Information query
