Invention Grant
- Patent Title: Method and apparatus of constructing secure infra-structure for using embedded universal integrated circuit card
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Application No.: US16198182Application Date: 2018-11-21
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Publication No.: US11025611B2Publication Date: 2021-06-01
- Inventor: Chul Hyun Park , Kwan Lae Kim , Jin Hyoung Lee , Joo Young Kim
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2012-0055054 20120523,KR10-2013-0057578 20130522
- Main IPC: H04L29/06
- IPC: H04L29/06 ; G06F21/77

Abstract:
A method of a responding entity for creating a secure link with a requesting entity in an embedded universal integrated circuit card (eUICC) environment is provided. The method includes: receiving, from the requesting entity, a secure link creation message including signature information of the requesting entity; verifying the signature information of the requesting entity by using trust information of the requesting entity, the trust information of the requesting entity being generated by a certificate authority (CA) and transferred to the responding entity; generating a shared key used for communication between the responding entity and the requesting entity; and creating the secure link with the requesting entity by using the shared key.
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