Invention Grant
- Patent Title: Filling material, resin composition, package, and light-emitting device
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Application No.: US16378985Application Date: 2019-04-09
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Publication No.: US11024776B2Publication Date: 2021-06-01
- Inventor: Yuji Akazawa , Koichi Okada
- Applicant: NICHIA CORPORATION
- Applicant Address: JP Anan
- Assignee: NICHIA CORPORATION
- Current Assignee: NICHIA CORPORATION
- Current Assignee Address: JP Anan
- Agency: Hunton Andrews Kurth LLP
- Priority: JPJP2016-250608 20161226
- Main IPC: H01L33/48
- IPC: H01L33/48 ; H01L33/60 ; C09C1/28 ; C08K9/02 ; C08K3/34 ; H01L33/56 ; C08K7/10
Abstract:
A filling material for a resin composition includes a base material and a coating material coating at least a portion of a surface of a particle of the base material. The base material comprises a first inorganic compound containing a Group II element. The coating material comprises a second inorganic compound containing the Group II element and is different from the first inorganic compound. A method of manufacturing the filling material is provided. A resin composition comprising the filling material, a package, a light-emitting device, and methods of manufacturing them are also provided.
Public/Granted literature
- US20190237632A1 FILLING MATERIAL, RESIN COMPOSITION, PACKAGE, AND LIGHT-EMITTING DEVICE Public/Granted day:2019-08-01
Information query
IPC分类:
