Invention Grant
- Patent Title: Method for manufacturing semiconductor device
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Application No.: US16358394Application Date: 2019-03-19
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Publication No.: US11024729B2Publication Date: 2021-06-01
- Inventor: Aryan Afzalian
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Maschoff Brennan
- Main IPC: H01L29/775
- IPC: H01L29/775 ; H01L29/10 ; H01L29/66

Abstract:
A method for manufacturing a semiconductor device includes forming a first source/drain region in a substrate. A core channel region is formed on the first source/drain region. A barrier layer is formed on the core channel region. A shell is formed lining sidewalls of the core channel region and sidewalls and top surface of the barrier layer. The shell includes a channel portion in contact with the core channel region and a barrier portion in contact with the barrier layer. A second source/drain region is formed above the shell. A first gate electrode is formed to surround the channel portion of the shell. A conduction energy band of the channel portion of the shell is aligned with a conduction energy band of the barrier portion of the shell.
Information query
IPC分类: