Invention Grant
- Patent Title: Thermocompression bond tips and related apparatus and methods
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Application No.: US15625676Application Date: 2017-06-16
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Publication No.: US11024595B2Publication Date: 2021-06-01
- Inventor: Benjamin L. McClain , Brandon P. Wirz , Zhaohui Ma
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: TraskBritt
- Main IPC: H01L21/48
- IPC: H01L21/48 ; H01L21/56 ; H01L23/00
Abstract:
A bond tip for thermocompression bonding a bottom surface includes a die contact area and a low surface energy material covering at least a portion of the bottom surface. The low surface energy material may cover substantially all of the bottom surface, or only a peripheral portion surrounding the die contact area. The die contact area may be recessed with respect to the peripheral portion a depth at least as great as a thickness of a semiconductor die to be received in the recessed die contact area. A method of thermocompression bonding is also disclosed.
Public/Granted literature
- US20180366434A1 THERMOCOMPRESSION BOND TIPS AND RELATED APPARATUS AND METHODS Public/Granted day:2018-12-20
Information query
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