- Patent Title: SMD diode taking a runner as body and manufacturing method thereof
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Application No.: US16677150Application Date: 2019-11-07
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Publication No.: US11024567B2Publication Date: 2021-06-01
- Inventor: Yunhui Zhong
- Applicant: Siyang Grande Electronics Co., Ltd.
- Applicant Address: CN Suqian
- Assignee: Siyang Grande Electronics Co., Ltd.
- Current Assignee: Siyang Grande Electronics Co., Ltd.
- Current Assignee Address: CN Suqian
- Agency: SZDC Law P.C.
- Priority: CN201510836602.5 20151126,CN201520955973.0 20151126
- Main IPC: H01L21/56
- IPC: H01L21/56 ; H01L23/495 ; H01L21/78 ; H01L21/66 ; H01L23/31 ; H01L29/861 ; H05K3/34
Abstract:
A surface mount (SMD) diode taking a runner as the body and a manufacturing method thereof are described. An elongated runner groove is adopted to cure and package groups of diode chips arranged side by side and corresponding copper pins thereon, with the utilization rate of epoxy resin up to 90% or more. The use cost of epoxy resin is thus reduced, and environmental pollution is also reduced.
Public/Granted literature
- US20200075465A1 SMD DIODE TAKING A RUNNER AS BODY AND MANUFACTURING METHOD THEREOF Public/Granted day:2020-03-05
Information query
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