A semiconductor device includes: a die pad; a semiconductor chip mounted on the die pad; a lead having an outer lead part and an inner lead par which is set up by a lead leg part extending from the outer lead part; an encapsulating resin sealing the die pad, the semiconductor chip, and the lead so that the lead is partially exposed; a support resin part provided on a bottom surface of the inner lead part, the support resin part being a portion of the encapsulating resin; and a notch part where the encapsulating resin is absent, and locating in a region surrounded by a bottom surface of the support resin part, an outer side surface of the outer lead part and an outer side surface of the lead leg part.