Invention Grant
- Patent Title: Lead frame system
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Application No.: US15296880Application Date: 2016-10-18
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Publication No.: US11024562B2Publication Date: 2021-06-01
- Inventor: Xingliang Deng , Minhui Ma , Qinghua Hu , Alex Ting Chin-Sern , Ruben Da Rolda, Jr.
- Applicant: Texas Instruments Incorporated
- Applicant Address: US TX Dallas
- Assignee: Texas Instruments Incorporated
- Current Assignee: Texas Instruments Incorporated
- Current Assignee Address: US TX Dallas
- Agent Dawn Jos; Charles A. Brill; Frank D. Cimino
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/544
Abstract:
A lead frame strip with corrugated saw street metal where the corrugated saw street metal is comprised of a partial thickness of the lead frame strip metal. A lead frame strip with corrugated saw street metal where the corrugated saw street metal is comprised of a half thickness of the lead frame strip metal.
Public/Granted literature
- US20170309546A1 LEAD FRAME SYSTEM Public/Granted day:2017-10-26
Information query
IPC分类:
