Invention Grant
- Patent Title: Semiconductor device and manufacturing method thereof
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Application No.: US16256534Application Date: 2019-01-24
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Publication No.: US11024549B2Publication Date: 2021-06-01
- Inventor: Jhon-Jhy Liaw
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Maschoff Brennan
- Main IPC: H01L21/8238
- IPC: H01L21/8238 ; H01L21/311 ; H01L29/78 ; H01L27/092 ; H01L29/66

Abstract:
A semiconductor device includes a substrate, a dielectric fin, a gate, and a high-k dielectric layer. The dielectric fin is above the substrate and extending along a first direction. The gate is above the substrate and extends in a second direction that intersects the first direction. The high-k dielectric layer is vertically above the dielectric fin. The gate is over a sidewall and a bottom surface of the high-k dielectric layer.
Information query
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