Invention Grant
- Patent Title: Ceramic electronic component and method of manufacturing the same and electronic device
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Application No.: US16837019Application Date: 2020-04-01
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Publication No.: US11024462B2Publication Date: 2021-06-01
- Inventor: Yoon Chui Son , Minoru Osada , Takayoshi Sasaki , Chan Kwak , Doh Won Jung , Youngjin Cho
- Applicant: SAMSUNG ELECTRONICS CO., LTD. , NATIONAL INSTITUTE FOR MATERIALS SCIENCE
- Applicant Address: KR Suwon-si; JP Tsukuba
- Assignee: SAMSUNG ELECTRONICS CO., LTD.,NATIONAL INSTITUTE FOR MATERIALS SCIENCE
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.,NATIONAL INSTITUTE FOR MATERIALS SCIENCE
- Current Assignee Address: KR Suwon-si; JP Tsukuba
- Agency: Cantor Colburn LLP
- Priority: KR10-2017-0141217 20171027
- Main IPC: H01G4/33
- IPC: H01G4/33 ; H01G4/248 ; H01G4/012 ; H01G4/12 ; H01C7/10 ; H01C7/00 ; H01G4/30
Abstract:
A method of manufacturing a ceramic electronic component includes forming a dielectric layer including a plurality of ceramic nanosheets on a first electrode, treating the dielectric layer with an acid, and forming a second electrode on the dielectric layer, a ceramic electronic component, and an electronic device.
Public/Granted literature
- US20200234888A1 CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME AND ELECTRONIC DEVICE Public/Granted day:2020-07-23
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