Invention Grant
- Patent Title: Compound and composition for forming organic film
-
Application No.: US16013728Application Date: 2018-06-20
-
Publication No.: US11022882B2Publication Date: 2021-06-01
- Inventor: Seiichiro Tachibana , Takeru Watanabe , Keisuke Niida , Hiroko Nagai , Takashi Sawamura , Tsutomu Ogihara , Alexander Edward Hess , Gregory Breyta , Daniel Paul Sanders , Rudy J. Wojtecki
- Applicant: SHIN-ETSU CHEMICAL CO., LTD. , INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: JP Tokyo; US NY Armonk
- Assignee: SHIN-ETSU CHEMICAL CO., LTD.,INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: SHIN-ETSU CHEMICAL CO., LTD.,INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: JP Tokyo; US NY Armonk
- Agency: Oliff PLC
- Main IPC: G03F7/025
- IPC: G03F7/025 ; C07C13/54 ; C07C43/23 ; G03F7/039 ; C08K5/00 ; C08L49/00 ; H01L21/027 ; H01L21/308

Abstract:
A compound shown by the following general formula (1-1), AR1 and AR2 each independently represent an aromatic ring or an aromatic ring containing at least one nitrogen and/or sulfur atom, two AR1s, AR1 and AR2, or two AR2s are optionally bonded; AR3 represents a benzene, naphthalene, thiophene, pyridine, or diazine ring; A represents an organic group; B represents an anionic leaving group; Y represents a divalent organic group; “p” is 1 or 2; “q” is 1 or 2; “r” is 0 or 1; “s” is 2 to 4; when s=2, Z represents a single bond, divalent atom, or divalent organic group; and when s=3 or 4, Z represents a trivalent or quadrivalent atom or organic group. This compound cures to form an organic film, and also forms an organic under layer film.
Public/Granted literature
- US20190391493A1 COMPOUND AND COMPOSITION FOR FORMING ORGANIC FILM Public/Granted day:2019-12-26
Information query
IPC分类: